Layers |
1-42L |
Material Types |
FR-4、FR-4(Middle.High Tg,Halogen Free etc) |
Max panel size |
20”×24.5* |
Min track width/space for inner layer |
3MIL/3MIL |
Min inner layer pad |
4MIL |
Inner layer copper thickness |
0.5(MIN)-4 OZ(MAX) |
Outer layer Copper thickness |
0.5(MIN)-4 OZ(MAX) |
Finished board thickness |
0.4-3.2mm |
Tolerance of finished board thickness |
Thickness<1.0mm |
±4MIL |
1.0mm<thickness<2.0mm |
±6MIL |
Thickness>=2.0mm |
±8MIL |
Inner layer surface finishing |
Negative Technology |
Layers Registration |
±4MIL |
Min hole-drilling size |
0.25MM |
Min finished hole size |
0.2MM |
Hole position accuracy |
±3MIL |
Slot Tolerance |
±5MIL |
PTH Tolerance |
±3MIL |
NPTH Tolerance |
±2MIL |
Max PTH A.R. |
8:1 |
Hole Wall thickness |
≤1MIL |
Outer layer image tolerance |
2MIL |
Min Outer layer track width/space |
4/4MIL |
SM thickness |
Line end |
≥15UM |
Line corner |
≥7.5UM |
SM hardness |
≥6H |
SM registration tolerance |
1.2MIL(MIN) |
Min SM dam |
3MIL(MIN) |
Max hole-plugging size |
0.6MM |
Surface Finishing |
HAL、immersion gold、Immersion Silver、OSP |
Range of nickel thickness for electroless nickel and immersion gold |
3-5UM |
Range of gold thickness for electroless nickel and immersion gold |
1-3U’ |
Impedance control and tolerance |
±10% |
Warp and twist |
≤0.75% |