| Layers |
1-42L |
| Material Types |
FR-4、FR-4(Middle.High Tg,Halogen Free etc) |
| Max panel size |
20”×24.5* |
| Min track width/space for inner layer |
3MIL/3MIL |
| Min inner layer pad |
4MIL |
| Inner layer copper thickness |
0.5(MIN)-4 OZ(MAX) |
| Outer layer Copper thickness |
0.5(MIN)-4 OZ(MAX) |
| Finished board thickness |
0.4-3.2mm |
| Tolerance of finished board thickness |
Thickness<1.0mm |
±4MIL |
| 1.0mm<thickness<2.0mm |
±6MIL |
| Thickness>=2.0mm |
±8MIL |
| Inner layer surface finishing |
Negative Technology |
| Layers Registration |
±4MIL |
| Min hole-drilling size |
0.25MM |
| Min finished hole size |
0.2MM |
| Hole position accuracy |
±3MIL |
| Slot Tolerance |
±5MIL |
| PTH Tolerance |
±3MIL |
| NPTH Tolerance |
±2MIL |
| Max PTH A.R. |
8:1 |
| Hole Wall thickness |
≤1MIL |
| Outer layer image tolerance |
2MIL |
| Min Outer layer track width/space |
4/4MIL |
| SM thickness |
Line end |
≥15UM |
| Line corner |
≥7.5UM |
| SM hardness |
≥6H |
| SM registration tolerance |
1.2MIL(MIN) |
| Min SM dam |
3MIL(MIN) |
| Max hole-plugging size |
0.6MM |
| Surface Finishing |
HAL、immersion gold、Immersion Silver、OSP |
| Range of nickel thickness for electroless nickel and immersion gold |
3-5UM |
| Range of gold thickness for electroless nickel and immersion gold |
1-3U’ |
| Impedance control and tolerance |
±10% |
| Warp and twist |
≤0.75% |
